AMD Sempron 3300+ vs Intel Core i3-2340UE
Physisch
| Socket | AMD Socket 754 | Intel BGA 1023 |
|---|---|---|
| Strukturgröße | 90 nm | 32 nm |
| Transistoren | 63 million | 624 million |
| Chipgröße | 84 mm² | 149 mm² |
| Package | µPGA | rPGA |
| Hersteller | — | Intel |
Leistung
| Taktfrequenz | 2000 MHz | 1300 MHz |
|---|---|---|
| Übertaktung | — | — |
| Basis-Taktfrequenz | 200 MHz | 100 MHz |
| Multiplikator | 10.0x | 13.0x |
| Multiplikator entsperrt | No | No |
| Stromspannung | 1.4 V | — |
| TDP | 62 W | 17 W |
Architektur
| Typ | Desktop | Mobile |
|---|---|---|
| Produktionsstatus | End-of-life | End-of-life |
| Veröffentlichungsdatum | Apr 1st, 2005 | Jun 1st, 2011 |
| Codename | Palermo | Sandy Bridge |
| Generation | Sempron | Core i3 |
| Part# | SDA3300AIO2BO | SR074 |
| Speicherunterstützung | unknown Single-channel | DDR3 Dual-channel |
| ECC-Speicher | No | No |
Kerne
| Anzahl der Kerne | 1 | 2 |
|---|---|---|
| Anzahl der Threads | 1 | 4 |
| SMP # CPUs | 1 | 1 |
| Integrierter Grafikprozessor | — | Intel HD 3000 |
Cache
| Cache L1 | 128K | 64K (per core) |
|---|---|---|
| Cache L2 | 256K | 256K (per core) |
| Cache L3 | — | 3MB (shared) |
Features
| 3DNow! | Yes | — |
|---|---|---|
| AMD64 | Yes | — |
| AVX | — | Yes |
| EIST | — | Yes |
| HTT | — | Yes |
| Intel 64 | — | Yes |
| MMX | Yes | Yes |
| SEE2 | Yes | — |
| SSE | Yes | Yes |
| SSE2 | — | Yes |
| SSE3 | Yes | Yes |
| SSE4.1 | — | Yes |
| SSE4.2 | — | Yes |
| SSSE3 | — | Yes |
| Smart Cache | — | Yes |
| VT-x | — | Yes |
| XD bit | — | Yes |
