AMD Sempron 3300+ vs Intel Core i3-2340UE
Physical Specifications
| Socket | AMD Socket 754 | Intel BGA 1023 |
|---|---|---|
| Process size | 90 nm | 32 nm |
| Transistors | 63 million | 624 million |
| Die size | 84 mm² | 149 mm² |
| Package | µPGA | rPGA |
| Foundry | — | Intel |
Performance
| Frequency | 2000 MHz | 1300 MHz |
|---|---|---|
| Turbo clock | — | — |
| Base clock | 200 MHz | 100 MHz |
| Multiplier | 10.0x | 13.0x |
| Multiplier unlocked | No | No |
| Voltage | 1.4 V | — |
| TDP | 62 W | 17 W |
Architecture Details
| Vertical Segment | Desktop | Mobile |
|---|---|---|
| Production status | End-of-life | End-of-life |
| Release date | Apr 1st, 2005 | Jun 1st, 2011 |
| Codename | Palermo | Sandy Bridge |
| Generation | Sempron | Core i3 |
| Part | SDA3300AIO2BO | SR074 |
| Memory support | unknown Single-channel | DDR3 Dual-channel |
| ECC memory | No | No |
Cores
| Total Cores | 1 | 2 |
|---|---|---|
| Total Threads | 1 | 4 |
| SMP # CPUs | 1 | 1 |
| Integrated graphics | — | Intel HD 3000 |
Cache
| Cache L1 | 128K | 64K (per core) |
|---|---|---|
| Cache L2 | 256K | 256K (per core) |
| Cache L3 | — | 3MB (shared) |
Features & Technologies
| 3DNow! | Yes | — |
|---|---|---|
| AMD64 | Yes | — |
| AVX | — | Yes |
| EIST | — | Yes |
| HTT | — | Yes |
| Intel 64 | — | Yes |
| MMX | Yes | Yes |
| SEE2 | Yes | — |
| SSE | Yes | Yes |
| SSE2 | — | Yes |
| SSE3 | Yes | Yes |
| SSE4.1 | — | Yes |
| SSE4.2 | — | Yes |
| SSSE3 | — | Yes |
| Smart Cache | — | Yes |
| VT-x | — | Yes |
| XD bit | — | Yes |
