AMD Sempron 3300+ vs Intel Core i3-560
Physical Specifications
| Socket | AMD Socket 754 | Intel Socket 1156 |
|---|---|---|
| Process size | 90 nm | 32 nm |
| Transistors | 63 million | 382 million |
| Die size | 84 mm² | 81 mm² |
| Package | µPGA | FC-LGA10 |
| Foundry | — | Intel |
Performance
| Frequency | 2000 MHz | 3.333 GHz |
|---|---|---|
| Turbo clock | — | — |
| Base clock | 200 MHz | 133 MHz |
| Multiplier | 10.0x | 25.0x |
| Multiplier unlocked | No | No |
| Voltage | 1.4 V | 1.4 V |
| TDP | 62 W | 73 W |
Architecture Details
| Vertical Segment | Desktop | Desktop |
|---|---|---|
| Production status | End-of-life | End-of-life |
| Release date | Apr 1st, 2005 | Aug 29th, 2010 |
| Codename | Palermo | Clarkdale |
| Generation | Sempron | Core i3 |
| Part | SDA3300AIO2BO | SLBY2 |
| Memory support | unknown Single-channel | DDR3 Dual-channel |
| ECC memory | No | No |
| PCI Express | — | Gen 2, 16 Lanes(CPU only) |
Cores
| Total Cores | 1 | 2 |
|---|---|---|
| Total Threads | 1 | 4 |
| SMP # CPUs | 1 | 1 |
| Integrated graphics | — | Intel HD |
Cache
| Cache L1 | 128K | 64K (per core) |
|---|---|---|
| Cache L2 | 256K | 256K (per core) |
| Cache L3 | — | 4MB (shared) |
Features & Technologies
| 3DNow! | Yes | — |
|---|---|---|
| AMD64 | Yes | — |
| HTT | — | Yes |
| Intel 64 | — | Yes |
| MMX | Yes | Yes |
| SEE2 | Yes | — |
| SSE | Yes | Yes |
| SSE2 | — | Yes |
| SSE3 | Yes | Yes |
| SSE4 | — | Yes |
| SSE4.1 | — | Yes |
| SSE4.2 | — | Yes |
| SSSE3 | — | Yes |
| VT-x | — | Yes |
| XD-Bit | — | Yes |
