AMD Sempron 3100+ vs Intel Core i7-10850H
物理
| 插座 | AMD Socket 754 | Intel BGA 1440 |
|---|---|---|
| 工艺尺寸 | 90 nm | 14 nm |
| 晶体管 | 63 million | unknown |
| 模具尺寸 | 84 mm² | unknown |
| 包 | µPGA | FC-BGA1440 |
| 铸造厂 | — | Intel |
| tCaseMax | — | 72°C |
| tJMax | — | 100°C |
性能
| 频率 | 1800 MHz | 2.7 GHz |
|---|---|---|
| 涡轮时钟 | — | up to 5.1 GHz |
| 基本时钟 | 200 MHz | 100 MHz |
| 乘数 | 9.0x | 27.0x |
| 乘数解锁 | No | No |
| 电压 | 1.4 V | — |
| TDP | 62 W | 45 W |
建筑
| 市场 | Desktop | Mobile |
|---|---|---|
| 生产状况 | End-of-life | Active |
| 发布日期 | Apr 1st, 2005 | Apr 2nd, 2020 |
| 代码名称 | Palermo | Comet Lake-H |
| 代 | Sempron | Core i7 |
| 部分 | SDA3100AIO3BASDA3100AIO3BOSDA3100AIO3BX | SRH8P |
| 内存支持 | unknown Single-channel | DDR4-2933 MHz Dual-channel |
| ECC内存 | No | No |
| PCI Express | — | Gen 3, 16 Lanes(CPU only) |
核心
| 核心数 | 1 | 6 |
|---|---|---|
| 线程数 | 1 | 12 |
| SMP # CPU | 1 | 1 |
| 集成显卡 | — | UHD Graphics |
快取
| 缓存 L1 | 128K | 64K (per core) |
|---|---|---|
| 缓存 L2 | 256K | 256K (per core) |
| 缓存 L3 | — | 12MB (shared) |
特征
| 3DNow! | Yes | — |
|---|---|---|
| AES-NI | — | Yes |
| AMD64 | Yes | — |
| AVX | — | Yes |
| AVX2 | — | Yes |
| BMI1 | — | Yes |
| BMI2 | — | Yes |
| Boost 2.0 | — | Yes |
| CLMUL | — | Yes |
| EIST | — | Yes |
| F16C | — | Yes |
| FMA3 | — | Yes |
| HTT | — | Yes |
| Intel 64 | — | Yes |
| MMX | Yes | Yes |
| SEE2 | Yes | — |
| SSE | Yes | Yes |
| SSE2 | — | Yes |
| SSE3 | Yes | Yes |
| SSE4.2 | — | Yes |
| SSSE3 | — | Yes |
| TSX | — | Yes |
| TXT | — | Yes |
| VT-d | — | Yes |
| VT-x | — | Yes |
| XD bit | — | Yes |
