AMD Phenom II X3 B77 vs Intel Core i3-2310E
物理
| 插座 | AMD Socket AM3 | Intel BGA 1023 |
|---|---|---|
| 工艺尺寸 | 45 nm | 32 nm |
| 晶体管 | 758 million | 624 million |
| 模具尺寸 | 258 mm² | 149 mm² |
| 包 | µPGA | rPGA |
| 铸造厂 | — | Intel |
性能
| 频率 | 3.2 GHz | 2.1 GHz |
|---|---|---|
| 涡轮时钟 | — | — |
| 基本时钟 | 200 MHz | 100 MHz |
| 乘数 | 16.0x | 21.0x |
| 乘数解锁 | No | No |
| 电压 | 1.425 V | — |
| TDP | 95 W | 35 W |
建筑
| 市场 | Desktop | Mobile |
|---|---|---|
| 生产状况 | End-of-life | End-of-life |
| 发布日期 | May 11th, 2010 | Feb 1st, 2011 |
| 代码名称 | Heka | Sandy Bridge |
| 代 | Phenom II X3 | Core i3 |
| 部分 | HDXB77WFK3DGM | SR077 |
| 内存支持 | DDR3 Dual-channel | DDR3 Dual-channel |
| ECC内存 | No | No |
| PCI Express | Gen 2 | — |
核心
| 核心数 | 3 | 2 |
|---|---|---|
| 线程数 | 3 | 4 |
| SMP # CPU | 1 | 1 |
| 集成显卡 | — | Intel HD 3000 |
快取
| 缓存 L1 | 128K (per core) | 64K (per core) |
|---|---|---|
| 缓存 L2 | 512K (per core) | 256K (per core) |
| 缓存 L3 | 6MB (shared) | 3MB (shared) |
笔记
| 笔记 | AMD Business Class processor, availability guaranteed for 24 months after release. | — |
|---|
特征
| 3DNow! | Yes | — |
|---|---|---|
| AMD-V | Yes | — |
| AMD64 | Yes | — |
| AVX | — | Yes |
| EIST | — | Yes |
| HTT | — | Yes |
| Intel 64 | — | Yes |
| MMX | Yes | Yes |
| NX bit | Yes | — |
| SSE | Yes | Yes |
| SSE2 | Yes | Yes |
| SSE3 | Yes | Yes |
| SSE4.1 | — | Yes |
| SSE4.2 | — | Yes |
| SSE4A | Yes | — |
| SSSE3 | — | Yes |
| Smart Cache | — | Yes |
| VT-x | — | Yes |
| XD bit | — | Yes |
