Socket | Intel Socket P | Intel BGA 1356 |
---|---|---|
Fonderie | Intel | Intel |
Taille du processus | 65 nm | 14 nm |
Transistors | 293 million | unknown |
Taille des matrices | 143 mm² | 123 mm² |
Package | FC-PGA | FC-BGA1356 |
tCaseMax | — | 72°C |
Fréquence | 2.4 GHz | 2.4 GHz |
---|---|---|
Turbo clock | — | up to 3.4 GHz |
Base clock | 200 MHz | 100 MHz |
Multiplicateur | 12.0x | 24.0x |
Multiplicateur débloqué | No | No |
Tension | 1.3 V | — |
TDP | 35 W | 15 W |
Marché | Mobile | Mobile |
---|---|---|
État de la production | End-of-life | Active |
Date de sortie | May 27th, 2007 | Feb 13th, 2018 |
Nom de code | Merom | Kaby Lake-R |
Génération | Core 2 Duo | Core i3 |
Part | SLA43SLAF7 | unknown |
Support mémoire | unknown | DDR4 |
La mémoire du CEC | No | No |
Nombre de cœurs | 2 | 2 |
---|---|---|
Nombre de threads | 2 | 4 |
SMP # CPUs | 1 | 1 |
Cartes graphiques intégrées | — | UHD 620 |
Cache L1 | 64K | 64K (per core) |
---|---|---|
Cache L2 | 4MB | 256K (per core) |
Cache L3 | — | 4MB (shared) |
AES-NI | — | Yes |
---|---|---|
AVX | — | Yes |
AVX2 | — | Yes |
BMI1 | — | Yes |
BMI2 | — | Yes |
Boost 2.0 | — | Yes |
CLMUL | — | Yes |
EIST | Yes | Yes |
F16C | — | Yes |
FMA3 | — | Yes |
HTT | — | Yes |
Intel 64 | Yes | Yes |
MMX | Yes | Yes |
SSE | Yes | Yes |
SSE2 | Yes | Yes |
SSE3 | Yes | Yes |
SSE4.2 | — | Yes |
SSSE3 | Yes | Yes |
TSX | — | Yes |
TXT | — | Yes |
VT-d | — | Yes |
VT-x | Yes | Yes |
XD bit | Yes | Yes |