Socket | Intel BGA 2270 | Intel Socket P |
---|---|---|
Fabricante | Intel | Intel |
Tamaño del proceso | 14 nm | 45 nm |
Transistores | unknown | 410 million |
Tamaño de Die | unknown | 107 mm² |
Paquete | FC-BGA2270 | — |
tCaseMax | 72°C | — |
Frecuencia | 3.1 GHz | 2.3 GHz |
---|---|---|
Frecuencia turbo | up to 4.1 GHz | — |
Frecuencia de reloj base | 100 MHz | 800 MHz |
Multiplicador | 31.0x | 11.5x |
Multiplicador desbloqueado | No | No |
TDP | 65 W | 35 W |
Voltaje | — | 1.15 V |
Mercado | Mobile | Mobile |
---|---|---|
Estado de producción | Active | End-of-life |
Fecha de publicación | Feb 1st, 2018 | Jan 1st, 2010 |
Nombre Clave | Kaby Lake G | Penryn |
Generación | Core i7 | Pentium Dual-Core |
Parte | unknown | SLGZC |
Soporte de memoria | DDR4 | DDR3 |
Memoria ECC | No | No |
Número de núcleos | 4 | 2 |
---|---|---|
Número de hilos | 8 | 2 |
SMP # CPUs | 1 | 1 |
Gráficos integrados | Radeon RX Vega M GL | — |
Caché L1 | 64K (per core) | 64K |
---|---|---|
Caché L2 | 256K (per core) | 1MB |
Caché L3 | 8MB (shared) | — |
AES-NI | Yes | — |
---|---|---|
AVX | Yes | — |
AVX2 | Yes | — |
BMI1 | Yes | — |
BMI2 | Yes | — |
Boost 2.0 | Yes | — |
CLMUL | Yes | — |
EIST | Yes | Yes |
F16C | Yes | — |
FMA3 | Yes | — |
HTT | Yes | — |
Intel 64 | Yes | Yes |
MMX | Yes | Yes |
MPX | Yes | — |
SGX | Yes | — |
SSE | Yes | Yes |
SSE2 | Yes | Yes |
SSE3 | Yes | Yes |
SSE4.2 | Yes | — |
SSSE3 | Yes | Yes |
TSX | Yes | — |
TXT | Yes | — |
VT-d | Yes | — |
VT-x | Yes | — |
XD bit | Yes | Yes |