AMD Sempron 3400+ vs Intel Core i3-350M
物理
| 插座 | AMD Socket AM2 | Intel Socket G1 |
|---|---|---|
| 工艺尺寸 | 90 nm | 32 nm |
| 晶体管 | 81 million | 382 million |
| 模具尺寸 | 103 mm² | 81 mm² |
| 包 | µPGA | rPGA |
| 铸造厂 | — | Intel |
性能
| 频率 | 1800 MHz | 2.267 GHz |
|---|---|---|
| 涡轮时钟 | — | — |
| 基本时钟 | 200 MHz | 133 MHz |
| 乘数 | 9.0x | 17.0x |
| 乘数解锁 | No | No |
| 电压 | 1.4 V | — |
| TDP | 62 W | 35 W |
建筑
| 市场 | Desktop | Mobile |
|---|---|---|
| 生产状况 | End-of-life | End-of-life |
| 发布日期 | May 23rd, 2006 | Jan 7th, 2010 |
| 代码名称 | Manila | Arrandale |
| 代 | Sempron | Core i3 |
| 部分 | SDA3400IAA3CNSDA3400IAA3CW | unknown |
| 内存支持 | unknown Dual-channel | DDR3 |
| ECC内存 | No | No |
| PCI Express | Gen 2 | Gen 2 |
核心
| 核心数 | 1 | 2 |
|---|---|---|
| 线程数 | 1 | 4 |
| SMP # CPU | 1 | 1 |
| 集成显卡 | — | — |
快取
| 缓存 L1 | 128K | 64K (per core) |
|---|---|---|
| 缓存 L2 | 256K | 256K (per core) |
| 缓存 L3 | — | 3MB (shared) |
特征
| 3DNow! | Yes | — |
|---|---|---|
| AES-NI | — | Yes |
| AMD64 | Yes | — |
| EIST | — | Yes |
| HTT | — | Yes |
| Intel 64 | — | Yes |
| MMX | Yes | Yes |
| SSE | Yes | Yes |
| SSE2 | Yes | Yes |
| SSE3 | Yes | Yes |
| SSE4.1 | — | Yes |
| SSE4.2 | — | Yes |
| SSSE3 | — | Yes |
| Smart Cache | — | Yes |
| TXT | — | Yes |
| Turbo Boost | — | Yes |
| VT-d | — | Yes |
| VT-x | — | Yes |
| XD bit | — | Yes |
笔记
| 笔记 | — | 177M GPU Transistors |
|---|
