AMD Phenom II X2 B57 vs Intel Core 2 Duo E8500
物理
| 插座 | AMD Socket AM3 | Intel Socket 775 |
|---|---|---|
| 工艺尺寸 | 45 nm | 45 nm |
| 晶体管 | 758 million | 410 million |
| 模具尺寸 | 258 mm² | 107 mm² |
| 包 | µPGA | FC-LGA6 |
| 铸造厂 | — | Intel |
| tCaseMax | — | 72°C |
性能
| 频率 | 3.2 GHz | 3.166 GHz |
|---|---|---|
| 涡轮时钟 | — | — |
| 基本时钟 | 200 MHz | 333 MHz |
| 乘数 | 16.0x | 9.5x |
| 乘数解锁 | No | No |
| 电压 | 1.425 V | 1.2 V |
| TDP | 80 W | 65 W |
建筑
| 市场 | Desktop | Desktop |
|---|---|---|
| 生产状况 | End-of-life | End-of-life |
| 发布日期 | May 11th, 2010 | Jan 1st, 2008 |
| 代码名称 | Callisto | Wolfdale |
| 代 | Phenom II X2 | Core 2 Duo |
| 部分 | HDXB57WFK2DGM | SLAPKSLB9K |
| 内存支持 | DDR3 Dual-channel | DDR1, DDR2, DDR3 Dual-channel |
| ECC内存 | No | No |
| PCI Express | Gen 2 | Gen 2 |
核心
| 核心数 | 2 | 2 |
|---|---|---|
| 线程数 | 2 | 2 |
| SMP # CPU | 1 | 1 |
| 集成显卡 | — | — |
快取
| 缓存 L1 | 128K (per core) | 64K (per core) |
|---|---|---|
| 缓存 L2 | 512K (per core) | 6MB (shared) |
| 缓存 L3 | 6MB (shared) | — |
笔记
| 笔记 | AMD Business Class processor, availability guaranteed for 24 months after release. | Spec Code of E0 Stepping: SLB9K |
|---|
特征
| 3DNow! | Yes | — |
|---|---|---|
| AMD-V | Yes | — |
| AMD64 | Yes | — |
| C1E | — | Yes |
| C2E | — | Yes |
| EIST | — | Yes |
| Intel 64 | — | Yes |
| MMX | Yes | Yes |
| NX bit | Yes | — |
| SSE | Yes | Yes |
| SSE2 | Yes | Yes |
| SSE3 | Yes | Yes |
| SSE4 | — | Yes |
| SSE4A | Yes | — |
| TXT | — | Yes |
| VT | — | Yes |
