Socket | AMD Socket FP6 | Intel BGA 2270 |
---|---|---|
Hersteller | TSMC | Intel |
Strukturgröße | 7 nm | 14 nm |
Transistoren | 9,800 million | unknown |
Chipgröße | 156 mm² | unknown |
Package | — | FC-BGA2270 |
tJMax | 105°C | — |
tCaseMax | — | 72°C |
Taktfrequenz | 2.7 GHz | 3.1 GHz |
---|---|---|
Übertaktung | up to 3.7 GHz | up to 4.1 GHz |
Basis-Taktfrequenz | 100 MHz | 100 MHz |
Multiplikator | 27.0x | 31.0x |
Multiplikator entsperrt | No | No |
TDP | 25 W | 65 W |
Typ | Mobile | Mobile |
---|---|---|
Produktionsstatus | Active | Active |
Veröffentlichungsdatum | Jan 6th, 2020 | Feb 1st, 2018 |
Codename | Renoir | Kaby Lake G |
Generation | Ryzen 3 | Core i7 |
Part# | unknown | unknown |
Speicherunterstützung | DDR4-4266 MHz Dual-channel | DDR4 |
ECC-Speicher | No | No |
PCI Express | Gen 3 | — |
Anzahl der Kerne | 4 | 4 |
---|---|---|
Anzahl der Threads | 4 | 8 |
SMP # CPUs | 1 | 1 |
Integrierter Grafikprozessor | Radeon Graphics 320SP | Radeon RX Vega M GL |
Cache L1 | 64K (per core) | 64K (per core) |
---|---|---|
Cache L2 | 512K (per core) | 256K (per core) |
Cache L3 | 4MB (shared) | 8MB (shared) |
AES | Yes | — |
---|---|---|
AES-NI | — | Yes |
AMD-V | Yes | — |
AMD64 | Yes | — |
AVX | Yes | Yes |
AVX2 | Yes | Yes |
BMI1 | Yes | Yes |
BMI2 | Yes | Yes |
Boost 2.0 | — | Yes |
CLMUL | — | Yes |
EIST | — | Yes |
EVP | Yes | — |
F16C | Yes | Yes |
FMA3 | Yes | Yes |
HTT | — | Yes |
Intel 64 | — | Yes |
MMX | Yes | Yes |
MPX | — | Yes |
Precision Boost 2 | Yes | — |
SGX | — | Yes |
SHA | Yes | — |
SMAP | Yes | — |
SMEP | Yes | — |
SMT | Yes | — |
SSE | Yes | Yes |
SSE2 | Yes | Yes |
SSE3 | Yes | Yes |
SSE4.1 | Yes | — |
SSE4.2 | Yes | Yes |
SSE4A | Yes | — |
SSSE3 | Yes | Yes |
TSX | — | Yes |
TXT | — | Yes |
VT-d | — | Yes |
VT-x | — | Yes |
XD bit | — | Yes |