AMD A6-1450 vs Intel Core i3-370M
物理
| 插座 | AMD Socket FT3 | Intel Socket G1 |
|---|---|---|
| 工艺尺寸 | 32 nm | 32 nm |
| 晶体管 | 1,178 million | 382 million |
| 模具尺寸 | 246 mm² | 81 mm² |
| 包 | BGA2 | rPGA |
| tCaseMax | 90°C | — |
| 铸造厂 | — | Intel |
性能
| 频率 | 1000 MHz | 2.4 GHz |
|---|---|---|
| 涡轮时钟 | up to 1400 MHz | — |
| 基本时钟 | 100 MHz | 133 MHz |
| 乘数 | 10.0x | 18.0x |
| 乘数解锁 | No | No |
| 电压 | 1.475 V | — |
| TDP | 8 W | 35 W |
建筑
| 市场 | Mobile | Mobile |
|---|---|---|
| 生产状况 | Active | End-of-life |
| 发布日期 | May 23rd, 2013 | Jun 20th, 2010 |
| 代码名称 | Temash | Arrandale |
| 代 | A6 | Core i3 |
| 部分 | AT1450IDJ44HM | unknown |
| 内存支持 | DDR3 | DDR3 |
| ECC内存 | No | No |
| PCI Express | — | Gen 2 |
核心
| 核心数 | 4 | 2 |
|---|---|---|
| 线程数 | 4 | 4 |
| SMP # CPU | 1 | 1 |
| 集成显卡 | Radeon HD 8250 | — |
快取
| 缓存 L1 | 128K (per core) | 64K (per core) |
|---|---|---|
| 缓存 L2 | 512K (per core) | 256K (per core) |
| 缓存 L3 | — | 3MB (shared) |
特征
| 3DNow! | Yes | — |
|---|---|---|
| AES | Yes | — |
| AES-NI | — | Yes |
| AMD-V | Yes | — |
| AMD64 | Yes | — |
| AVX | Yes | — |
| BMI1 | Yes | — |
| CnQ | Yes | — |
| EIST | — | Yes |
| F16C | Yes | — |
| HTT | — | Yes |
| Intel 64 | — | Yes |
| MMX | Yes | Yes |
| NX bit | Yes | — |
| SSE | Yes | Yes |
| SSE2 | Yes | Yes |
| SSE3 | Yes | Yes |
| SSE4.1 | Yes | Yes |
| SSE4.2 | Yes | Yes |
| SSE4A | Yes | — |
| SSSE3 | — | Yes |
| Smart Cache | — | Yes |
| TXT | — | Yes |
| Turbo Boost | — | Yes |
| VT-d | — | Yes |
| VT-x | — | Yes |
| XD bit | — | Yes |
笔记
| 笔记 | — | 177M GPU Transistors |
|---|
